In response to the explosive growth of artificial intelligence (AI) and high-performance computing (HPC), the thermal challenges caused by increasing power density have become a critical issue in modern technology development. Chung Yuan Christian University (CYCU) has established the Thermal Management Center (TMC), the first academic research center in Taiwan dedicated specifically to thermal management. On March 12, CYCU held the unveiling ceremony of the TMC Innovation Field, creating a platform that integrates thermal management research and hands-on learning to meet the global demand for green computing power and sustainable development.
CYCU emphasized that in the era where computing power defines national competitiveness, thermal management is no longer merely a supporting engineering function but a core design factor that determines system performance limits and operational stability. The Thermal Management Center brings together an interdisciplinary team specializing in heat transfer, materials, and system integration. The center is led by Director Professor Hui-Chu Weng, Deputy Director Professor Chuan-Chieh Liao, and core members including Professors Wen-Ken Lee, Chien-Sheng Huang, and Yu-Chin Chien from the Department of Mechanical Engineering. Together, the team possesses integrated capabilities spanning fundamental research, system architecture design, and end-application development in thermal management technologies.
The unveiling ceremony was attended by numerous industry partners, including Hong-Jin Precision, Quanta Computer, Supermicro, Kao Li Heat Treatment, Kao Li Thermal Energy, Kao-Bo Technology, Sybotech, Tiger Technology, Luguang Sustainability Consulting Center, and the AION Sustainability Center. During the guided tour, students from the Department of Mechanical Engineering demonstrated several research systems, including phase-change material applications, pool-boiling heat transfer testing, and immersion-cooling thermal management systems for energy storage. Industry representatives expressed strong interest in the future development and application potential of thermal management technologies.
Professor Hui-Chu Weng, Distinguished Professor of Mechanical Engineering and Director of TMC, noted that as AI and HPC continue to expand, thermal management has become a core technology that determines system performance limits and operational reliability. It also plays a crucial role in improving energy efficiency and reducing operational costs for data centers. Located on the fifth floor of the Engineering Building, the TMC Innovation Field serves not only as a laboratory but also as a central research hub integrating topics such as heat transfer, energy systems, and sustainability. The facility is equipped with advanced thermal management materials and performance testing systems, supporting both academic research and industry-university collaboration while providing hands-on learning opportunities for students.
Professor Weng further explained that CYCU is planning to establish an AI Computing Co-Design Laboratory and a demonstration classroom for AI data-center cooling systems. Through real-time monitoring and data feedback, students will be able to observe dynamic heat-flow behavior in realistic scenarios, transforming theoretical knowledge into practical problem-solving skills and embodying CYCU’s philosophy of “learning by doing.”
During the industry-academia forum held the same day, participants from academia and industry engaged in in-depth discussions on future research directions, technological bottlenecks, and talent cultivation. The goal is to build consensus through the innovation field and create a forward-looking research ecosystem closely connected with industry needs. Professor Weng remarked, “Thermal management is closely coupled with computing power planning, energy efficiency, and sustainability goals. Through this innovation field, we hope students can engage with real-world cooling challenges during their studies and become the driving force behind defining the limits of future computing power.”
In response to the environmental challenges brought by the rapid expansion of AI technologies, the establishment of the TMC Innovation Field highlights CYCU’s strong foundation in advanced engineering research, industry collaboration, and talent development. CYCU stated that it will continue strengthening partnerships with industry and aims to position Taiwan as a global hub for thermal management research and development. The university also hopes its students will contribute their expertise and innovation to further reinforce Taiwan’s strategic advantages in the global technology sector.
