To strengthen industry engagement and develop talent with both technical expertise and practical experience, Chung Yuan Christian University (CYCU) has partnered with Teradyne, a global leader in automated test equipment, to offer industry-oriented courses, hands-on training opportunities, and part-time internships. As part of the collaboration, Richard Hsieh, Vice President of Sales for Asia Pacific at Teradyne, delivered a keynote lecture at CYCU on June 1, exploring the evolving landscape of semiconductor testing in the era of artificial intelligence (AI) and high-performance computing (HPC). The event provided students with valuable insights into emerging technologies and future career opportunities in the semiconductor industry.
According to Hsiang-Yuan Cheng, Director of CYCU’s Master’s Program in Semiconductor Materials and Optoelectronic Inspection, the University has partnered with Teradyne this semester to launch an industry–academia course on High-Performance Computing and Co-Packaged Optics Testing, addressing the growing demand for testing talent driven by AI, HPC, advanced packaging, and silicon photonics technologies. In addition to classroom learning, students will participate in hands-on training at Teradyne’s Hsinchu facility, gaining valuable industry experience and strengthening their practical skills.
During his keynote presentation, Richard Hsieh, Vice President of Sales for Asia Pacific at Teradyne, highlighted how the rapid growth of AI, advanced packaging, automotive electronics, and data centers is increasing the complexity of semiconductor products and testing requirements. He emphasized that capabilities such as Known Good Die (KGD), system-level testing, and high-parallelism testing will become increasingly important in the AI era, encouraging students to stay attuned to industry trends and build the expertise needed for future career opportunities.
To further strengthen industry–academia collaboration, Teradyne has announced one-year part-time internship opportunities, extending classroom learning into a real-world corporate environment and providing students with valuable hands-on experience. The company is also establishing a student talent database to support future recruitment of semiconductor test engineers. Teradyne noted that the initiative will help bridge the gap between academia and industry while strengthening Taiwan’s pipeline of advanced testing talent, supporting the long-term development of the semiconductor workforce.
The High-Performance Computing and Co-Packaged Optics Testing course, jointly developed by CYCU and Teradyne, is taught by a team of senior application engineers and doctoral-level experts from the company. The 16-week program focuses on semiconductor testing, automated test equipment (ATE), optoelectronic packaging, and silicon photonics measurement technologies, with hands-on laboratory sessions conducted at Teradyne’s Hsinchu facility using industry-grade equipment.
CYCU noted that the partnership not only bridges the gap between academia and industry, but also supports talent development in response to the rapid growth of AI, high-performance computing, advanced packaging, and silicon photonics. Through continued collaboration with global industry leaders such as Teradyne, the University aims to cultivate future-ready semiconductor professionals and establish a new benchmark for industry–academia cooperation.
