Chung Yuan Christian University’s (CYCU) College of Electrical Engineering and Computer Science signed a Memorandum of Understanding (MOU) with the Faculty of Engineering at Japan’s University of Hyogo on October 30, 2026, strengthening academic collaboration in semiconductor research and engineering education.
The partnership will promote faculty and student exchanges, joint research, and academic symposiums, focusing on semiconductor materials, advanced manufacturing processes, and electronic devices. By sharing research expertise and academic resources, both universities aim to expand international learning opportunities and cultivate globally competitive engineering talent.
The agreement was facilitated by Dean Koji Sumitomo and Professor Noriaki Toyoda of the University of Hyogo’s Faculty of Engineering, building on ongoing academic exchanges between the two institutions.
During his visit to CYCU from October 27 to 31, Professor Toyoda delivered a lecture titled “Nano-processing using Gas Cluster Ion Beams and Its Application to Semiconductor Processes,” introducing advanced nanofabrication technologies and their applications in semiconductor manufacturing.
Earlier in April 2026, Professor Tai-Chen Kuo led a CYCU delegation to the University of Hyogo’s Himeji Campus for the first bilateral academic symposium, attended by 27 CYCU students. The event featured technical presentations, student research sharing, and academic discussions, fostering deeper engagement between the two universities.
Professor Kuo, Director of the Office of Globalization Promotion at CYCU’s College of Electrical Engineering and Computer Science, emphasized that the MOU represents a significant milestone in the universities’ ongoing partnership. Through joint research, academic exchanges, and future symposiums, CYCU aims to strengthen semiconductor innovation while providing students with valuable international research experience.
The collaboration underscores CYCU’s commitment to advancing international academic partnerships and developing the next generation of engineering and semiconductor professionals.
